Active cooling debris bypass fin pack

ABSTRACT

Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, a cooling system in a computing device may include a heatpipe which moves heat along a fin pack. The fin pack may include top and bottom ends as well as a plurality of fins. The fins may extend only a portion of the way between the ends thus creating an air duct. The air duct may allow debris to move along an edge of the fin and out of the computing device. The fins may also be curved to promote the forcing of debris through the fin pack while still allowing the heat to be expelled through the fins.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a divisional of U.S. patent application Ser.No. 13/765,817, filed on Feb. 13, 2013, which is a continuation of U.S.patent application Ser. No. 13/438,312, filed on Apr. 3, 2012, thedisclosures of which are incorporated herein by reference.

BACKGROUND

In a typical computing device, a processor and other components cangenerate significant amount of heat. It is important to remove the heatfrom the processor in order to protect the processor and othercomponents in the device. In order to expel the heat, it is typicallytransported through heat pipes into a fin pack. The heat is thenconducted through the fins of the fin pack. A blower, or fan, blows airthrough the fin pack, and the air collects heat from the fins. Theheated air leaves the fin pack and is expelled from the computing devicethrough an exhaust vent.

As computing devices have become thinner and more compact, the fin packshave had to become smaller as well. Typical fin packs may have verynarrow fins (for example only a few tenths of a mm wide). The greaterthe surface area of the fins, the greater the amount of heat that can beexpelled by blowing air through the fins. In order to maximize theamount of surface area, typical fins span the height of the openingbetween a bottom end of the fin pack to the top end of the fin packadjacent to the heat pipe. The fins may also be tightly spaced (forexample only 1 mm apart).

This tight packing of the fins can cause debris to collect along thefins, such as fibers dust or other particles. The debris may increasethe noise of the fan blowing through the fin pack, decrease the amountof air flowing through the fins, and decrease the amount of expelledheat. By reducing the efficiency of the fin pack, the operatingtemperature of the processor may also increase. In order to protect theprocessor, the computing device and users, the computing device mayincrease the fan speed to expel the heat, creating more noise, and/orslow down the speed of the processor. These may be an annoyance to usersof these devices, and may also degrade the device's performance.

SUMMARY

One aspect of the disclosure provides a fin pack for expelling heat froma computing device. The fin pack includes a housing having a firstsidewall, a second sidewall opposite of the first sidewall, a thirdsidewall between the first and the second sidewalls, a fourth sidewallopposite of the third sidewall and adjacent the first and secondsidewalls, and an open first end adjacent the first, second, third, andfourth sidewalls and an open second end opposite of the open first endand adjacent the first second third and fourth sidewalls. The fin packalso includes a set of fins disposed in the housing. The set of fins isarranged to conduct heat from the first sidewall towards the secondsidewall. Each fin of the set of fins is fixed to the first sidewall andextending towards the second sidewall. At least one of the fins of theset of fins does not contact the second sidewall such that there is anopening between an edge of the at least one fin and the second sidewall.The edge of the at least one fin is oriented towards the secondsidewall. The opening between the edge extends along a complete lengthof the edge between the first open end and the second open end.

In one example, the edge of the at least one fin is curved at a portionof the edge adjacent to the open first end. In another example, the atleast one fin has a first curve shape and the set of fins includes asecond fin having a second curve shape. In this example, the second finhas a second height that is less than the distance between the firstsidewall and the second sidewall to define a second opening between anedge of the at least one fin and the second sidewall, and the secondcurve shape is different from the first curve shape. In yet anotherexample, the set of fins includes a second fin having a second heightthat spans the distance between the first sidewall and the secondsidewall such that there is no opening between the second fin and thesecond sidewall. In a further example, the opening is no less than 0.1millimeters. In another example, the fin pack also includes a pluralityof openings between edges of each fin of the set of fins and the secondsidewall such that there is an open space in the housing that extendsfrom the third sidewall to the fourth sidewall.

Another aspect of the disclosure provides a fin pack for expelling heatfrom a computing device. The fin pack includes a housing having a firstsidewall, a second sidewall opposite of the first sidewall, a thirdsidewall between the first and the second sidewalls, a fourth sidewallopposite of the third sidewall and adjacent the first and secondsidewalls, and an open first end adjacent the first, second, third, andfourth sidewalls. The housing also includes an open second end oppositeof the open first end and adjacent the first second third and fourthsidewalls. The fin pack also includes a first set of fins disposed inthe housing. The first set of fins is arranged to conduct heat from thefirst sidewall towards the second sidewall. Each fin of the first set offins is fixed to the first sidewall and extending towards the secondsidewall. The fin pack also includes a second set of fins disposed inthe housing. The second set of fins is arranged to conduct heat from thesecond sidewall towards the first sidewall. Each fin of the second setof fins is fixed to the second sidewall and extending towards the firstsidewall. A first fin of the first set of fins extends towards a secondfin of the second set of fins, such that the first fin and the secondfin are a corresponding pair of opposing fins such that a closest fin ofthe second set of fins to the first fin of the first set of fins is thesecond fin of the second set of fins. An edge of the first fin and anedge of the second fin is oriented towards one another and are adistance apart.

In one example, a portion of the edge of the first fin curved. Inanother example, the first fin has a first curve shape and the secondfin has a second curve shape, wherein the first curve shape is differentfrom the second curve shape. In yet another example, the fin pack alsoincludes a full fin between the first sidewall and the second sidewall,and the full fin has a second height that spans the distance between thefirst sidewall and the second sidewall. In another example, the fin packalso includes plurality of openings between edges of each fin of the setof fins and the second sidewall such that there is an open space in thehousing that extends from the third sidewall to the fourth sidewall. Inyet another example, the first fin of the first set of fins and thesecond fin of the second set of fins are arranged along an imaginaryaxis which is perpendicular to both the first and second sidewalls.

Yet another aspect of the disclosure provides a computing device. Thecomputing device includes a processor configured to executeinstructions, and heat is generated during execution of theinstructions. The computing device also includes a heat pipe whichtransfers heat from the processor, and a fin pack adjacent to andcontacting the heat pipe. The fin pack includes a housing having a firstsidewall, a second sidewall opposite of the first sidewall, a thirdsidewall between the first and the second sidewalls, a fourth sidewallopposite of the third sidewall and adjacent the first and secondsidewalls, and an open first end adjacent the first, second, third, andfourth sidewalls. The housing also includes an open second end oppositeof the open first end and adjacent the first second third and fourthsidewalls. The fin pack also includes a set of fins disposed in thehousing. The set of fins are arranged to conduct heat from the firstsidewall towards the second sidewall. Each fin of the set of fins isfixed to the first sidewall and extending towards the second sidewall.At least one of the fins of the set of fins not contacting the secondsidewall such that there is an opening between an edge of the at leastone fin and the second sidewall. The edge of the at least one fin isoriented towards the second sidewall, and the opening between the edgeextends along a complete length of the edge between the first open endand the second open end. The computing device also includes a blower forblowing air through the fin pack from the first open end towards thesecond open end to move the heat from the set of fins out of the finpack. The opening is configured to allow debris to move freely throughthe fin pack from the first open end to the second open end.

In one example, the edge of the at least one fin is curved at a portionof the edge adjacent to the open first end and the curved portion allowsthe debris to move through the opening. In another example, the at leastone fin has a first curve shape and the set of fins includes a secondfin having a second curve shape, the second fin having a second heightthat is less than the distance between the first sidewall and the secondsidewall such that there is an opening between an edge of the at leastone fin and the second sidewall, the second curve shape is differentfrom the first curve shape. In another example, the set of fins includesa second fin having a second height that spans the distance between thefirst sidewall and the second sidewall such that the second fin contactsthe second sidewall. In yet another example, the fin pack furtherincludes a plurality of openings between edges of each fin of the set offins and the second sidewall such that there is an open space in thehousing that extends from the third sidewall to the fourth sidewall.

A further aspect of the disclosure provides a computing device. Thecomputing device includes a fin pack adjacent to a heat pipe whichtransfers heat from the processor. The fin pack includes a housinghaving a first sidewall, a second sidewall opposite of the firstsidewall, a third sidewall between the first and the second sidewalls, afourth sidewall opposite of the third sidewall and adjacent the firstand second sidewalls. The housing also includes an open first endadjacent the first, second, third, and fourth sidewalls and an opensecond end opposite of the open first end and adjacent the first secondthird and fourth sidewalls. The fin pack also includes a first set offins disposed in the housing. The first set of fins is arranged toconduct heat from the first sidewall towards the second sidewall. Eachfin of the first set of fins is fixed to the first sidewall andextending towards the second sidewall. The fin pack also includes asecond set of fins disposed in the housing. The second set of fins isarranged to conduct heat from the second sidewall towards the firstsidewall. Each fin of the set of fins is fixed to the second sidewalland extending towards the first sidewall. A first fin of the first setof fins extends towards a second fin of the second set of fins. Thefirst fin and the second fin are a corresponding pair of opposing finssuch that a closest fin of the second set of fins to the first fin ofthe first set of fins is the second fin of the second set of fins. Anedge of the first fin and an edge of the second fin are oriented towardsone another and being a distance apart. The computing device alsoincludes a blower for blowing air through the fin pack from the firstopen end towards the second open end to move the heat from the first andsecond sets of fins out of the computing device, wherein the opening isconfigured to allow debris to move freely through the fin pack from thefirst open end to the second open end.

In one example, the first fin has a first curve shape and the second finhas a second curve shape, wherein the first curve shape is differentfrom the second curve shape. In another example, the computing devicealso includes a plurality of openings between edges of each fin of theset of fins and the second sidewall such that there is an open space inthe housing that extends from the third sidewall to the fourth sidewall.In yet another example, the computing device is a laptop computer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1C are diagrams of example prior art fin packs.

FIGS. 2A and 2B are diagrams of an example fin pack in accordance withan implementation of the disclosure.

FIGS. 3A and 3B are cross sectional views of the example fin pack ofFIGS. 2A and 2B.

FIG. 4 is an example computing device in accordance with animplementation of the disclosure.

FIG. 5A is a cross sectional view of an example fin pack in accordancewith aspects of the disclosure.

FIGS. 5B and 5C are example fin packs in accordance with aspects of thedisclosure.

FIG. 6 is an example computing device in accordance with animplementation of the disclosure.

FIGS. 7A-7E are cross sectional views of an example fin packs inaccordance with aspects of the disclosure.

FIGS. 8A-8D are diagrams of an example fin packs in accordance withimplementations of the disclosure.

DETAILED DESCRIPTION

Aspects of the disclosure relate generally to active cooling or removingheat generated by a processor in a computing device. In a typical mobilecomputing device (such as a laptop computer), heat is transportedthrough a heat pipe and into a fin pack. Fin pack 100 of FIG. 1A is anexample of a typical fin pack. The fin pack includes a housing having afirst end 102, a second end 104, a top wall 106, a bottom wall (notshown), a first sidewall 108, and a second sidewall (not shown). Thefins 110 may be very narrow, for example 0.1-0.5 mm, and the spaces 120between the fins only slightly wider, for example 1 mm.

A blower, or fan, blows air through the fin pack in order to force theheat from the fin pack and the computing device. For example, as shownin FIG. 1B, air flows in the direction of arrows 130 towards the firstend 102, through the spaces 120 between the fins 110, and out the secondend 104 along arrows 140.

As the fan blows air through the fin pack, dust, fibers, and otherparticles may collect along the fins. For example, as fibers 150 may becaught along the fins at the first end 102 of the fin pack 100.Eventually, for example, after only a few months of use, the spaces 120of fins 110 may become clogged by the fibers 150 as shown in FIG. 1C.

As noted above, clogging may cause a number of ill effects including,increasing the noise of the fan blowing through the fin pack anddecreasing the amount of expelled heat. This, in turn, may increase theoperating temperature of the processor as well as the temperature of ahousing of the computing device. For example, if the skin or surface ofthe housing is close to the processor, fin pack, and/or heat pipe, theheat from these features may cause the skin temperature to increase. Inorder to protect the processor, the computing device, and users, thecomputing device may increase the fan speed to expel the heat (creatingmore noise) or slow down the speed processor (to reduce the amount ofheat produced).

FIGS. 2A and 2B depict an example of a fin pack 200 arranged to reducethe likelihood of clogging described above. Fin pack 200 includes afirst end 202 and an opposite, second end 204. When used in a computingdevice, the first end 202 is oriented towards a fan (not shown) or asource of moving air such that the air moves from the first end 202towards the second end 204. Fin pack 200 also includes a partiallyenclosed housing having a top wall 206, a bottom wall 214, a first sidewall 208, and a second side wall 212. In one example, the height of thefin pack (e.g. distance between the top and bottom walls 206, 214) maybe only a few millimeters, such as 4.0 mm, or much larger. The fin pack200 may include a set of fins, including fins 210, arranged along awall, such as the top wall 206 of the fin pack. Each fin 210 is arrangedperpendicularly to the top wall, although the fins may also be fixed atdifferent angles The fins 210 have two flat side surfaces (such as 211)which are opposite to one another and an edge (see, e.g. edge 330 ofFIG. 3A) between the side surfaces. Between the flat side surfaces oftwo adjacent different fins is an opening 220. The fins may be about 0.2mm wide and spaced about 1.0 mm apart. The length and depth of the finpack may depend upon the available space in the computing device.

FIGS. 3A and 3B depict a cross sectional view of the fin pack 200. Inthis view, a fin 210 conducts heat from the top wall 206 towards thebottom wall 214. However, rather than spanning the distance between thetop wall and the bottom wall, fin 210 ends at edge 330 leaving anopening 320 below the fin 210. As can be seen in FIG. 3B, the opening320 extends from the first end 202 to the second end 204 and, althoughnot shown in the figures, between the first side surface 208 to thesecond side surface 212. This opening between the edge and the bottomwall may be slightly lightly larger than the debris expected to be blowntowards the fin pack. For example if a hair is about 0.3 mm, the openingmay be about 0.5 mm or larger. As described in more detail below, theopening may act as an air duct which allows debris such as dust, fibers,and other particles to pass below the fins of the fin pack.

In this example, the edge of the fin 210 includes a first portion 332, asecond portion 334, and a third portion 336. The second portion 334 ofthe fin includes a curved, rounded, or chamfered edge. This portion ofthe fins may promote the movement of debris through the fin pack whilestill allowing the heat to be expelled through the fins. The secondportion, though depicted as curved in FIG. 3A, may also have otherconfigurations such as a substantially flat or planar edge. The firstportion 332 and third portion 336 are shown as substantially flat orplanar edges, however, these portions may have other arrangements aswell.

The computing device housing the fin pack may include a processor,memory, instructions, and other components typically present in generalpurpose computers. For example, as shown in FIG. 4, a computing device400 may include a plurality of features such as a processor 410, a heatpipe 420, a fan 430, and the fin pack 200. Processor 410 may actuallyinclude one or more processors depending upon the arrangement of thefeatures of computing device 400. It will be understood that thearrangement depicted is merely an illustrative example and not arequired arrangement, orientation, sizing, etc. of the features ofcomputing device 400. The computing device 400 may include variousmobile computing devices such as a cellular phone, tablet PC, netbook,laptop computer, e-book reader, or other such devices with a relativelythin profile, for example a few centimeters or less.

As noted above, the computing device may include a processor whichgenerates heat. As shown in FIG. 4, this heat generated by the processor410 is transferred (as shown by heat arrow 412) to a heatpipe 420. Theheatpipe 420 is located adjacent to and may also contact the top wall206. The heat from the heat pipe is then conducted through the fin packfrom the top wall 206 towards the bottom wall 214 (as shown by arrows414, 416, 418). The fan 430 blows air, in the direction of air flowarrow 422 towards the fin pack 200. The air moves through the fin packand along the fins 210 and out of the fin pack 200, and in someexamples, the computing device 400 (as shown by air flow arrow 424).

As noted above, the opening may allow debris to move through the finpack rather than being caught up against the fins. The opening 320allows debris, identified as dots 450A-D, to move through and eventuallyout of the fin pack, rather than becoming stuck against the fin 210. Forexample, debris 450A-D may be a hair or other item which has been blownagainst fin 210. The first portion 332 (shown in FIG. 3A) of the edge330 is angled away from the air flow. This angling may allow the debrisat 450A of FIG. 4 to move along the edge of the fin 210 towards thesecond portion 334 (shown in FIG. 3A) of the edge 330. Returning to FIG.4, when the debris reaches 450B, the curved portion of the edge 330allows the debris to move towards the second end 204 of the fin pack200. The debris continues to move along through the opening (as shown bydebris 450C) until it has been expelled from the fin pack, and in someexamples, the computing device (as shown by debris 450D).

The expulsion of debris from the fin pack, and in some examples, thecomputing device, may reduce the likelihood that debris will clog thefins. This in turn may reduce the likelihood that the device will needto increase the fan speed or reduce the processing speed of theprocessor to maintain a safe or required temperature. In addition,because of the relatively small height of the fin pack, the fin pack maystill effectively transfer and expel heat even with the loss of surfacearea due to the shortened fins.

Other configurations of the fins may also be used. For example, as shownin FIG. 5A, a fin pack 500 may include a housing similar to the housingof fin pack 200: a top wall 506, bottom wall 514, and two side walls(not shown). The fin pack 500 also includes a first end 502 and a secondend 504. As with the fin pack 200, when in use, the first end isoriented towards a fan (not shown) or a source of moving air such thatthe air moves from the first end 502 towards the second end 504.

Fin pack 500 may also include two sets of fins, rather than a single setas with fin pack 200. In this example, a fin 510A of a first set of finsmay extend into the fin pack from the top wall 506 of the housing, and afin 510B of a second set of fins may extend into the fin pack from thebottom wall 514 of the housing. Each of the fins 510A of the first setof fins is arranged perpendicularly to the top wall 506 while each ofthe fins 510B of the second set of fins is arranged perpendicularly tothe bottom wall 514. However, the fins need not be perpendicular to thetop and/or bottom walls, but may be fixed at other angles. Each of thefins of fin pack 500 includes two side surfaces which are opposite toone another and an edge (see, e.g. edges 530A and 530B of FIG. 5A)between the side surfaces. Between the flat side surfaces of twoadjacent fins of the same set of fins is an opening 520 (similar toopening 220 of FIG. 2B).

In the examples of a fin pack having two sets of fins (as in the exampleof fin pack 500), each fin of the first set of fins may be associatedwith an opposing fin of the second set of fins. For example, fins 510Aand 510B of each of the examples of FIGS. 5B and 5C may be opposingfins. In these examples, the closest fin to fin 510A of the first set offins is fin 510A's opposing fin, or fin 510B. These fins may line updirectly above and below one another as shown in fin pack 540 of FIG. 5Bor may be staggered as shown in fin pack 560 of FIG. 5C. For example, inFIG. 5B, fins 510A and 510B are lined up along an imaginary longitudinalaxis 542 which is perpendicular to the top and bottom walls 506, 514. InFIG. 5B, fins 510A and 510B are each lined up along imaginarylongitudinal axes 562 and 564, respectively. These imaginarylongitudinal axes are parallel to one another, but both perpendicular tothe top and bottom walls 506, 514. As shown in FIG. 5A, the fins 510Aand 510B may not extend the total distance between the top wall 506 andthe bottom wall 514. This may result in the opening 520 between theedges of the opposing fins.

In this configuration, the fin pack may be adjacent to two differentheat pipes, one heat pipe being adjacent one end of the fin pack andanother heat pack being adjacent the other end of the fin pack. Forexample, computing device 600 may include processors 610A and 610B.Although depicted as two distinct processors, these processors mayactually be the same (i.e. a single) processor. The computing device 600may be similar to computing device 400, for example include a processor,memory, instructions, and other components typically present in generalpurpose computers. It will be understood that the arrangement depictedis merely an illustrative example and not a required arrangement,orientation, sizing, etc. of the features of computing device 600.

Returning to FIG. 5A, the fins 510A and 510B each conduct heat from thetop wall 206 or the bottom wall 214. In this example, each fin includesan edge 530A or 530B having a first portion 532A or 532B, a secondportion 534A or 534B, and a third portion 536A or 536B. The secondportions of the fin may include a curved, rounded, or chamfered edge.These curved portions of the fins may promote the movement of debristhrough the fin pack while still allowing the heat to be expelledthrough the fins. As with the portions of fin 210 of FIG. 3, the first,second, and third portions of fins 510A and 510B of FIG. 5A may alsohave other arrangements.

Processors 610A and 610B of FIG. 6 generate heat during operation. Theheat is transferred (as shown by heat arrows 612A and 612B) to heatpipes620A and 620B. Each heatpipe is located adjacent to and may also contactthe top wall 506 or bottom wall 514 of fin pack 500. The heat from theheat pipes is then conducted through the fin pack. For example heat fromheat pipe 620A is conducted through fin 510A as shown by arrows 614A,616A, 618A, from the top wall 506 towards the bottom wall 514, and heatfrom the heatpipe 620B is conducted through fin 510B from the bottomwall 514 towards the top wall 506 as shown by arrows 614B, 616B, 618B.The fan 630 blows air, in the direction of air flow arrow 622 towardsthe fin pack 500. The air moves through and along the fins 510A and 510Band out of the fin pack, and in some examples, the computing device (asshown by air flow arrow 624).

As with opening 320, opening 520 may allow debris to move freely throughthe fin pack rather than being caught up against the fins (see FIGS. 1Band 1C). For example, the opening 520 allows debris, represented by dots650A-D or 655A-D, to move through and eventually out of the fin pack,rather than becoming stuck against the fins 510A or 510B. In oneexample, debris 650A-D may be a hair or other item which has been blownagainst fin 510A. The first portion 532A (shown in FIG. 5A) of the edge530A is angled away from the air flow. This angling may allow the debrisat 650A of FIG. 6 to move along the edge of the fin 510A towards thesecond portion 534A (shown in FIG. 5A) of the edge 530A. Returning toFIG. 6, when the debris reaches 650B, the curved portion of the edge 530allows the debris to move towards the second end 504 of the fin pack500. The debris continues to move along through the opening (as shown bydebris 650C) until it has been expelled from the fin pack, and in someexamples, the computing device as well (as shown by debris 650D).

In another example, debris 655A-D may be a hair or other item which hasbeen blown against fin 510B. The first portion 532B (shown in FIG. 5A)of the edge 530 is angled away from the air flow. This angling may allowthe debris at 655A of FIG. 6 to move along the edge of the fin 510Btowards the second portion 534B (shown in FIG. 5A) of the edge 530B.Returning to FIG. 6, when the debris reaches 655B, the curved portion ofthe edge 530 allows the debris to move towards the second end 504 of thefin pack 500. The debris continues to move along through the opening (asshown by debris 655C) until it has been expelled from the fin pack, anin some examples, the computing device as well (as shown by debris655D).

The fin packs may have various configurations depending on the spaceavailable for the fin pack. For example, although fin packs 100, 200,and 500 have an s-shaped profile, other fins, such as fin packs 700,720, 740, 760, and 780 may have a rectangular profile (as shown in FIGS.7A-7E).

In addition to the shapes and configurations of the examples depicted byfins 210 and 510, the fins may have any number of configurations andshapes as noted above. For example, FIGS. 7A and 7B depict “single” finpacks 700 and 720 (similar to fin pack 200) having a single set of fins.Fin packs 700 and 720 include fins 702 and 722 of different shapes.FIGS. 7C-7E depict “dual” fin packs 740, 760, and 780 (similar to finpack 500) having two sets of fins: 742A and 742B, 762A and 762B, 782Aand 782B. Fin packs 720, 760, and 780 include fins 722, 762A, 762B, and782A having a more gradual curve that fins 210, 510A, 510B, or 702 offin packs 200, 500, or 700. Like fin pack 200, fin packs 700 and 720include openings 704 and 724 which may allow debris to move freelythrough the fin packs and be expelled from a computing device (asdescribed with regard to fin back 200 above). Similarly, like fin pack500, fin packs 740, 760, and 780 include openings 744, 764, and 784which allow debris to move freely through the fin packs and be expelledfrom a computing device (as described with regard to fin pack 500above).

In another example, although fins 510A and 510B are shown as symmetricalin fin pack 500, as shown in FIG. 7E, fin pack 780 may includeasymmetrical fins 782A and 782B. In such a heat pack, the length of thefins may be determined based on the amount of heat to be expelled from aheat pipe. For example, if a typical fin pack, with no air duct opening,were used between two heat pipes, where the first heat pipe is hotter ormore efficient than the second heat pipe, there may be a reduction inthe temperature of the fins at a point between the top and bottom walls.It is at this point that the air duct may be placed between two sets offins in order to allow debris to move freely through the fin pack whilestill maintaining a high level of efficiency.

In still other examples, the fin packs may include a single or doubleset of fins where each set has plurality of fins of different heights.For example, only some of the fins may span the distance between the topwall and the bottom wall, such as every other fin or every two or morefins. The number of fins in a row that need not span this distance willdefine the width of the duct and also the size of debris that may beforced through the duct. Returning to the examples of fin pack 200 ofFIGS. 2A and 2B, all of the fins between the sidewalls 208 and 212 donot span the entire distance between the top wall 206 and the bottomwall 214. As noted above other fin packs, for instance those shown inFIGS. 8A and 8B, may include fins of different heights. For example,FIG. 8A includes fin pack 800 having fins 810A which include an openingbetween the top wall 806 and the bottom wall 814. These fins allow fordebris to move below the fins. Fin pack 800 also includes a full fin810B which extends between the top wall and the bottom wall 814 suchthat there is no opening between the full fin and the bottom wall. Inthis example, the fin pack is essentially divided into two sets (set816A and set 816A) of fins. Each set is associated with an opening, 816Band 818B, respectively. Rather than spanning from the first sidewall 812of the fin pack to the second sidewall 808 of the fin pack as withopenings 320 and 520, openings 818A and 818B span only the distancebetween the sidewalls and full fin 810B. Similar to openings 320 and520, openings 818A and 818B may allow debris to flow through the finpack.

A fin pack may also have several full fins (such as fin 810B) withvarious numbers of shortened fins (fin 810A) between them. For example,FIGS. 8A and 8B depict example fin packs 800 and 820, where several fullfins 810B are evenly spaced in the fin pack. FIG. 8C depicts an examplefin pack 840 where several full fins 810B are spaced at varyingintervals. In other words, in FIG. 8C, the number of shortened fins 810Abetween two full fins or between a sidewall and a full fin, varies. Inanother example, shown in FIG. 8D, the fin pack may include fins 810Aand 810C of different shapes within the same set of fins. A fin pack maytherefore include at least one shorted fin (such as fin 210, 510A, 510B,702, 722, 742A, 742B, 762A, 762B, 782A, 782B, 810A, or 810C) and anynumber of full and or shortened fins.

In yet another example, a fin pack may include shortened fins ofdifferent heights. For example, as shown in FIG. 8D, fin pack 840includes shortened fins 810A of a first shape, full fins 810B, andshortened fins 810C of a different shape from shortened fins 810A. Aswith the full fins, the shortened fins of a different shape may bespaced evenly or at various intervals.

The fin packs described herein may be made of various metals or otherheat conducting materials. For example, the housing and fins may beformed of a metal (including alloys) with a low thermal resistance inorder to conduct the heat down or along the fins as described above.

As these and other variations and combinations of the features discussedabove can be utilized without departing from the subject matter definedby the claims, the foregoing description of the embodiments should betaken by way of illustration rather than by way of limitation of thesubject matter defined by the claims. It will also be understood thatthe provision of the examples disclosed herein (as well as clausesphrased as “such as,” “including” and the like) should not beinterpreted as limiting the claimed subject matter to the specificexamples; rather, the examples are intended to illustrate only one ofmany possible embodiments. Further, the same reference numbers indifferent drawings may identify the same or similar elements.

The invention claimed is:
 1. A fin pack for expelling heat from acomputing device, the fin pack comprising: a housing having a firstsidewall, a second sidewall opposite of the first sidewall, a thirdsidewall between the first and the second sidewalls, a fourth sidewallopposite of the third sidewall and adjacent the first and secondsidewalls, and an open first end adjacent the first, second, third, andfourth sidewalls and an open second end opposite of the open first endand adjacent the first second third and fourth sidewalls; a first set offins disposed in the housing, the first set of fins being arranged toconduct heat from the first sidewall towards the second sidewall, eachfin of the first set of fins being fixed to the first sidewall andextending towards the second sidewall; a second set of fins disposed inthe housing, the second set of fins being arranged to conduct heat fromthe second sidewall towards the first sidewall, each fin of the secondset of fins being fixed to the second sidewall and extending towards thefirst sidewall; wherein a first fin of the first set of fins extendstowards a second fin of the second set of fins, such that the first finand the second fin are a corresponding pair of opposing fins such that aclosest fin of the second set of fins to the first fin of the first setof fins is the second fin of the second set of fins, an edge of thefirst fin and an edge of the second fin being oriented towards oneanother and being a distance apart, and a portion of the edge of thefirst fin is curved away from the first open end and towards the secondsidewall and the second open end in order to assist debris in movingthrough the housing along the portion of the first fin away from thefirst open end and towards the second sidewall and the second open end.2. The fin pack of claim 1, wherein the first fin has a first curveshape and the second fin has a second curve shape, wherein the firstcurve shape is different from the second curve shape, and the secondcurve shape is arranged to assist debris in moving from the open firstend towards the second sidewall and the open second end.
 3. The fin packof claim 1, further comprising a full fin between the first sidewall andthe second sidewall, the full fin having a second height that spans thedistance between the first sidewall and the second sidewall.
 4. The finpack of claim 1, further comprising a plurality of openings betweenedges of each fin of the set of fins and at least one of the second setof fins or the second sidewall such that there is an open space in thehousing that extends from the third sidewall to the fourth sidewall. 5.The fin pack of claim 1, wherein the first fin of the first set of finsand the second fin of the second set of fins are arranged along animaginary axis which is perpendicular to both the first and secondsidewalls.
 6. A computing device comprising: a fin pack adjacent to aheat pipe which transfers heat from a processor, the fin pack having: ahousing having a first sidewall, a second sidewall opposite of the firstsidewall, a third sidewall between the first and the second sidewalls, afourth sidewall opposite of the third sidewall and adjacent the firstand second sidewalls, and an open first end adjacent the first, second,third, and fourth sidewalls and an open second end opposite of the openfirst end and adjacent the first second third and fourth sidewalls andan opening between the open first end and the open second end; a firstset of fins disposed in the housing, the first set of fins beingarranged to conduct heat from the first sidewall towards the secondsidewall, each fin of the first set of fins being fixed to the firstsidewall and extending towards the second sidewall; a second set of finsdisposed in the housing, the second set of fins being arranged toconduct heat from the second sidewall towards the first sidewall, eachfin of the second set of fins being fixed to the second sidewall andextending towards the first sidewall; wherein a first fin of the firstset of fins extends towards a second fin of the second set of fins, suchthat the first fin and the second fin are a corresponding pair ofopposing fins such that a closest fin of the second set of fins to thefirst fin of the first set of fins is the second fin of the second setof fins, an edge of the first fin and an edge of the second fin beingoriented towards one another and being a distance apart, and a portionof the edge of the first fin is curved away from the open first end andtowards the second sidewall and the open second end in order to assistdebris in moving through the housing along the portion of the first finaway from the open first end and towards the second sidewall and theopen second end; and a blower for blowing air through the fin pack fromthe first open end towards the second open end to move the heat from thefirst and second sets of fins out of the computing device, wherein theopening is configured to allow debris to move freely through the finpack from the first open end to the second open end.
 7. The computingdevice of claim 6, wherein the first fin has a first curve shape and thesecond fin has a second curve shape, wherein the first curve shape isdifferent from the second curve shape , and the second curve shape isarranged to assist debris in moving from the open first end towards thesecond sidewall and the open second end.
 8. The computing device ofclaim 6, further comprising a plurality of openings between edges ofeach fin of the first set of fins and at least one of the second set offins or the second sidewall such that there is an open space in thehousing that extends from the third sidewall to the fourth sidewall. 9.The computing device of claim 6, wherein the computing device is alaptop computer.
 10. The computing device of claim 6, further comprisingthe processor.
 11. The computing device of claim 6, further comprising afull fin between the first sidewall and the second sidewall, the fullfin having a second height that spans the distance between the firstsidewall and the second sidewall.
 12. The computing device of claim 7,further comprising a first heat pipe adjacent the first sidewall and asecond heat pipe adjacent the second sidewall.
 13. The computing deviceof claim 12, wherein the second heat pipe is configured to generate moreheat than the first heat pipe and the first curve shape and the secondcurve shape are configured based on an amount of heat generated by thefirst heat pipe and the second heat pipe.